Chip package and method for forming the same

ABSTRACT

A method for forming a chip package, in which a substrate has a plurality of conducting pads located below its lower surface, and a dielectric layer located between the conducting pads. A hole is formed extending from the upper surface of the substrate towards the conducting pads. After the hole is formed, a trench is formed extending from the upper surface towards the lower surface of the substrate, with the trench connecting with the hole. An insulating layer is formed on a sidewall of the trench and a sidewall and a bottom of the hole, and a portion of the insulating layer and a portion of the dielectric layer are removed to expose a portion of the conducting pads. A conducting layer is formed on the sidewall of the trench and the sidewall and the bottom of the hole, electrically contacting with the conducting pads.

CROSS REFERENCE

This application is a Divisional of U.S. application Ser. No.13/190,388, filed on Jul. 25, 2011, which is a Continuation-In-Part ofpending U.S. patent application Ser. No. 13/044,457, filed Mar. 9, 2011,now U.S. Pat. No. 8,525,345, and entitled “Chip package and method forforming the same”, which claims the benefit of U.S. ProvisionalApplication No. 61/313,087, filed on Mar. 11, 2010 and claims thebenefit of U.S. Provisional Application No. 61/315,850, filed on Mar.19, 2010, the entirety of which are incorporated by reference herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a chip package, and in particularrelates to a chip package having a through-substrate via(through-substrate via, TSV).

2. Description of the Related Art

Recently, through-substrate vias are frequently being formed in a chippackages to accommodate miniaturization and multi-functionalityrequirements of chips. In order to further improve the functionality ofthe chip, conducting routes to the through-substrate vias need to beimproved, such that high density conducting routes may be achieved evenif the size of the chip package continues to shrink. In addition, it isdesired to improve the structural reliability of the through-substratevia.

BRIEF SUMMARY OF THE INVENTION

According to an embodiment of the invention, a chip package is provided.The chip package includes: a substrate having an upper surface and alower surface; a plurality of conducting pads located under the lowersurface of the substrate; a dielectric layer located between theconducting pads; a trench extending from the upper surface towards thelower surface of the substrate; a hole extending from a bottom of thetrench towards the lower surface of the substrate, wherein an uppersidewall of the hole inclines to the lower surface of the substrate, anda lower sidewall or a bottom of the hole exposes a portion of theconducting pads; and a conducting layer located in the hole andelectrically connected to at least one of the conducting pads.

According to an embodiment of the invention, a method for forming a chippackage is provided. The method includes: providing a substrate havingan upper surface and a lower surface, wherein the substrate comprises: aplurality of conducting pads located below the lower surface of thesubstrate; and a dielectric layer located between the conducting pads;removing a portion of the substrate from the upper surface of thesubstrate to form a hole extending towards the conducting pads; afterthe hole is formed, removing a portion of the substrate from the uppersurface of the substrate to form a trench extending towards the lowersurface of the substrate, wherein the trench connects with the hole;forming an insulating layer on a sidewall of the trench and a sidewalland a bottom of the hole; removing a portion of the insulating layer anda portion of the dielectric layer to expose a portion of the conductingpads; and forming a conducting layer on the sidewall of the trench andthe sidewall and the bottom of the hole, wherein the conducting layerelectrically contacts with the conducting pads.

According to an embodiment of the invention, a method for forming a chippackage is provided. The method includes: providing a substrate having afirst surface and a second surface, wherein the substrate comprises: aplurality of conducting pads located on the first surface of thesubstrate; and a dielectric layer located between the conducting pads;disposing a carrier substrate on the conducting pads and the dielectriclayer on the first surface of the substrate; removing a portion of thecarrier substrate from an upper surface of the carrier substrate to forma hole extending towards the conducting pads; after the hole is formed,removing a portion of the carrier substrate from the upper surface ofthe carrier substrate to form a trench extending towards the substrate,wherein the trench connects with the hole; forming an insulating layeron the sidewall of the trench and the sidewall and the bottom of thehole; removing a portion of the insulating layer and a portion of thedielectric layer to expose a portion of the conducting pads; and forminga conducting layer on the sidewall of the trench and the sidewall andthe bottom of the hole, wherein the conducting layer electricallycontacts with the conducting pads.

A detailed description is given in the following embodiments withreference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention can be more fully understood by reading thesubsequent detailed description and examples with references made to theaccompanying drawings, wherein:

FIGS. 1A-1C are cross-sectional views showing the steps of forming achip package according to an embodiment of the present invention;

FIGS. 2A-2C are enlarged cross-sectional views showing the steps offorming a chip package according to an embodiment of the presentinvention;

FIGS. 3A-3C are enlarged cross-sectional views showing the steps offorming a chip package according to an embodiment of the presentinvention;

FIGS. 4A-4B are enlarged cross-sectional views showing the steps offorming a chip package according to an embodiment of the presentinvention;

FIG. 5 is an enlarged cross-sectional view partially showing a chippackage according to an embodiment of the present invention;

FIGS. 6A-6E are top views partially showing chip packages according toembodiments of the present invention;

FIG. 7 is a cross-sectional view showing a chip package according to anembodiment of the present invention;

FIGS. 8-13 are cross-sectional views showing the steps of forming a chippackage according to an embodiment of the present invention;

FIGS. 14A-14B are cross-sectional views showing the steps of forming achip package according to another embodiment of the present invention;

FIGS. 15A-15C are enlarged cross-sectional views showing the steps offorming a chip package according to an embodiment of the presentinvention;

FIGS. 16A-16C are enlarged cross-sectional views showing the steps offorming a chip package according to an embodiment of the presentinvention;

FIGS. 17A-17C are cross-sectional views showing the steps of forming achip package according to an embodiment of the present invention;

FIGS. 18A-18G are cross-sectional views showing the steps of forming achip package according to an embodiment of the present invention; and

FIGS. 19A-19F are cross-sectional views showing the steps of forming achip package according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The following description is of the best-contemplated mode of carryingout the invention. This description is made for the purpose ofillustrating the general principles of the invention and should not betaken in a limiting sense. The scope of the invention is best determinedby reference to the appended claims.

It is understood, that the following disclosure provides many differentembodiments, or examples, for implementing different features of theinvention. Specific examples of components and arrangements aredescribed below to simplify the present disclosure. These are, ofcourse, merely examples and are not intended to be limiting. Note thatthe present disclosure may repeat reference numbers and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed. Furthermore,descriptions of a first layer “on,” “overlying,” (and like descriptions)a second layer include embodiments where the first and second layers arein direct contact and those where one or more layers are interposing thefirst and second layers.

A chip package according to an embodiment of the present invention maybe applied to active or passive devices, or electronic components withdigital or analog circuits, such as opto electronic devices, microelectro mechanical systems (MEMS), micro fluidic systems, and physicalsensors for detecting heat, light, or pressure. Particularly, a waferscale package (WSP) process may be applied to package semiconductorchips, such as image sensor devices, light-emitting diodes (LEDs), solarcells, RF circuits, accelerators, gyroscopes, micro actuators, surfaceacoustic wave devices, pressure sensors, ink printer heads, or powermodules.

The wafer scale package process mentioned above mainly means that afterthe package process is accomplished during the wafer stage, the waferwith chips is cut to obtain separate independent packages. However, in aspecific embodiment, separate independent chips may be redistributedoverlying a supporting wafer and then be packaged, which may also bereferred to as a wafer scale package process. Note that the abovementioned wafer scale package process may also be adapted to form chippackages of multi-layer integrated circuit devices by stacking aplurality of wafers having integrated circuits.

In a chip package according to embodiments of the invention, eachpattern of the multi-layered conducting pads is designed such that athrough-substrate conducting structure formed in the package mayelectrically contact with the multi-layered conducting pads, improvingthe structural reliability of the chip package and increasing conductingroutes connected to the through-substrate conducting structure.

FIGS. 1A-1C are cross-sectional views showing the steps of forming achip package according to an embodiment of the present invention. Asshown in FIG. 1A, a substrate is provided, which includes an uppersurface 100 a and a lower surface 100 b. The substrate 100 may include,for example, a semiconductor material or a ceramic material. In oneembodiment, the substrate 100 may be a semiconductor wafer (such as asilicon wafer) which benefits performing of a wafer-level packageprocess. Adopting a wafer-level package process to form a chip packagemay reduce fabrication cost and time.

In one embodiment, the substrate 100 includes a conducting pad structure110 which is located under the lower surface 100 b of the substrate 100.However, in another embodiment, the conducting pad structure 110 may belocated in the substrate 100. The conducting pad structure 110 is astacked structure of a plurality of conducting pads, such as a pluralityof conducting pads having dielectric layers interposed therebetween. Thestructure of the conducting pad structure 110 will be illustrated indetail with references made to FIGS. 2A-2C which are enlargedcross-sectional views showing the steps of forming a chip packageaccording to an embodiment of the invention. In the embodiment shown inFIG. 1A, the conducting pad structure 110 is located below the lowersurface 100 b of the substrate 100 and separated from the lower surface100 b of the substrate 100 by an insulating layer 102. In addition, asubstrate 106 may be disposed under the substrate 100 and the conductingpad structure 110. The substrate 106 may include, for example, aninsulating material. In one embodiment, the substrate 106 may be aspacer layer disposed on a glass substrate.

Referring to FIG. 2A, an enlarged cross-sectional view showing the areaA of the embodiment in FIG. 1A is illustrated. A conducting pad 110 b, adielectric layer 113, a conducting pad 110 a, and the insulating layer102 are formed on the substrate 106. In one embodiment, a pattern of theconducting pad 110 a is designed such that a portion of the conductingpad 110 b thereunder is exposed. In one embodiment, the conducting pad110 a has at least an opening (or a trench) 602. The opening 602 exposesthe dielectric layer 113 and the conducting pad 110 b directly below theopening. That is, in this embodiment, an upper conducting pad (110 a)has at least an opening (or a trench) which exposes a lower conductingpad (110 b). It should be appreciated that “exposed” herein does notmean that the conducting pad 110 can be seen and means that the opening602 overlaps with a portion of the conducting pad 110 b directly belowthe opening.

Next, a hole is formed in the substrate 100. The hole extends from theupper surface 100 a towards the lower surface 100 b of the substrate100, and the hole exposes a portion of the conducting pad 110 a and aportion of the conducting pad 110 b. In one embodiment, the hole isformed in a single etching process. In another embodiment, the hole isstepwise formed. Hereafter, examples are provided to illustrate theprocedure of stepwise forming the hole exposing a portion of theconducting pad 110 a and a portion of the conducting pad 110 b.

For example, referring to FIG. 1A, in this embodiment, a first hole 108is formed from the upper surface 100 a of the substrate 100. The firsthole 108 extends towards the conducting pad structure 110 (i.e., extendstowards the conducting pad 110 a). Take the embodiment of FIG. 1A as anexample, the first hole 108 penetrates the substrate 100 and stops atthe insulating layer 102 between the substrate 100 and the conductingpad structure 110. Then, an insulating layer 104 may be optionallyformed on a sidewall and a bottom of the first hole 108 to electricallyisolate the substrate 100 and a conducting layer, which is subsequentlyformed in the hole.

Next, as shown in FIG. 1B, a second hole 112 is formed from the bottomof the first hole 108. That is, portions of the insulating layers 104and 102 are removed such that the conducting pad structure 110thereunder is exposed. Note that the second hole 112 further exposes theconducting pads 110 a and 110 b. Referring to FIG. 2B, an enlargedcross-sectional view showing the area A of the embodiment of FIG. 1B isillustrated.

As shown in FIGS. 2A and 2B, the formation step of the second hole 112includes removing the insulating layer 102 in the opening 602 of theconducting pad 110 a and a portion of the dielectric layer 113thereunder. In one embodiment, a sidewall of the formed second hole 112exposes a portion of the conducting pad 110 a. For example, a side ofthe conducting pad 110 a is exposed, as shown in FIG. 2B. In oneembodiment, a bottom of the formed second hole 112 exposes a portion ofthe conducting pad 110 b. For example, an upper surface of theconducting pad 110 b is exposed, as shown in FIG. 2B. Because only aninsulating material is removed during the formation of the hole 112, thehole may be formed in a single etching process. Note that the etchingrate of the chosen etchant for the dielectric material or insulatingmaterial is preferably higher than that for the metal material orconducting material.

As mentioned above, the pattern of the conducting pad 110 a is designedto expose a portion of the conducting pad 110 b thereunder. Thus, duringthe formation of the second hole 112, the materials which are removedare substantially the insulating material in the opening 602 of theconducting pad 110 a and the dielectric material thereunder. The secondhole 112 may be therefore formed in a single etching process.

FIG. 6A is a top view partially showing a chip package according to anembodiment of the present invention, which merely shows a relationshipbetween the conducting pads 110 a and 110 b. It should be appreciatedthat the top view shown in FIG. 6A is only used to illustrate a specificexample, but not used to limit embodiments of the present invention. Asshown in FIG. 6A, the conducting pad 110 a has at least an opening 602which exposes the conducting pad 110 b thereunder. That is, theconducting pads 110 a and 110 b with different depths are exposed in thesecond hole 112.

Next, referring to FIG. 1C, a conducting layer 114 is formed in a holeformed by the first hole 108 and the second hole 112. Referring to FIG.2C, an enlarged cross-sectional view showing the area A of theembodiment in FIG. 1C is illustrated. As shown in FIG. 2C, theconducting layer 114 extends into the second hole 112 and electricallycontacts with the conducting pad 110 a and the conducting pad 110 b. Inone embodiment, the conducting layer 114 may be fixed in the second hole112 for a better structural stability. The conducting layer 114simultaneously contacts with the conducting pad 110 a and the conductingpad 110 b such that the conducting layer 114 may be connected to moreconducting routes. In one embodiment, the conducting pad 110 a and theconducting pad 110 b are connected to a same electronic device. Becausethe conducting layer 114 simultaneously and electrically contacts withthe conducting pad 110 a and the conducting pad 110 b, a short of theconducting routes connected to the electronic device may be ensured fromoccurring. In another embodiment, the conducting pad 110 a and theconducting pad 110 b are connected to different electronic devices,respectively. The different electronic devices may transmit or receiveelectrical signals through the conducting layer 114 and the conductingpad 110 a and the conducting pad 110 b, respectively.

The conducting pad structure 110 according to embodiments of theinvention includes not only two conducting pads (110 a, 110 b), but mayfurther include another conducting pad. FIGS. 3A-3C are enlargedcross-sectional views showing the steps of forming a chip packageaccording to another embodiment of the present invention, wherein sameor similar reference numbers are used to designate same or similarelements. Note that because the main difference between the embodimentshown in FIG. 3 and the embodiment shown in FIG. 2 is the design of theconducting pad structure 110, reference may be made to the descriptionscorresponding to FIGS. 1A-1C concerning the fabrication method of theembodiment shown in FIG. 3. Thus, repeated descriptions are notprovided.

As shown in FIG. 3A, in one embodiment, the chip package includes theconducting pad 110 a and the conducting pad 110 b and further includes aconducting pad 110 c which is located in a dielectric layer between theconducting pads 110 a and 110 b. As shown in FIG. 3A, the conducting pad110 b, a dielectric layer 113 a, the conducting pad 110 c, a dielectriclayer 113 b, the conducting pad 110 a, and the insulating layer 102 areformed on the substrate 106. In one embodiment, a pattern of theconducting pad 110 a is designed to expose a portion of the conductingpad 110 c thereunder and a portion of the conducting pad 110 b. In oneembodiment, the conducting pad 110 a has at least an opening (or atrench) 602. The opening 602 exposes the dielectric layer 113 b, theconducting pad 110 c thereunder, the dielectric layer 113 a, and theconducting pad 110 b thereunder. In addition, a pattern of theconducting pad 110 c is also designed to have at least an opening (or atrench). The opening 604 exposes the dielectric layer 113 a and theconducting pad 110 b thereunder.

In other words, a chip package according to an embodiment of the presentinvention includes a plurality of conducting pads (such as theconducting pads 110 a, 110 c, 110 b), wherein an upper conducting pad ofthe conducting pads has at least an opening or a trench exposing a lowerconducting pad of the conducting pads. For example, the conducting pad110 a (the upper conducting pad) has the opening 602 exposing theconducting pads 110 c and 110 b (the lower conducting pads). Similarly,the conducting pad 110 c (the upper conducting pad) has the opening 604exposing the conducting pad 110 b (the lower conducting pad).

Then, a hole is formed in the substrate 100. The hole extends from theupper surface 100 a towards the lower surface 100 b of the substrate100. The hole exposes a portion of the conducting pad 110 a, a portionof the conducting pad 110 c, and a portion of the conducting pad 110 c.In one embodiment, the hole is formed in a single etching process. Inanother embodiment, the hole is stepwise formed.

Similarly, in this embodiment, the first hole 108 may also be firstformed (as shown in FIG. 1A), and the second hole 112 is then formed atthe bottom of the first hole 108, as shown in FIG. 1B. FIG. 3B are anenlarged cross-sectional view showing the structure near the second hole112.

Similarly, during the formation of the second hole 112, the materialwhich is removed is substantially the insulating material in the opening602 and the dielectric material thereunder. Thus, the second hole 112may be formed in a single etching process.

FIG. 6B is a top view partially showing a chip package according to anembodiment of the present invention, which merely shows a relationshipbetween the conducting pads 110 a, 110 b, and 110 c. It should beappreciated that the top view shown in FIG. 6B is only used toillustrate a specific example, but not used to limit embodiments of thepresent invention. As shown in FIG. 6B, the conducting pad 110 a has atleast an opening 602 which exposes the conducting pads 110 c and 110 bthereunder. In addition, the conducting pad 110 c has at least anopening 604 which exposes the conducting pad 110 b thereunder. That is,the conducting pads 110 a, 110 c, and 110 b with different depths areexposed in the second hole 112.

Similarly, as shown in FIG. 3C, the conducting layer 114 is then formed,which extends into the second hole 112 to electrically contact with theconducting pads 110 a, 110 c, and 110 b. In one embodiment, theconducting layer 114 may be fixed in the second hole 112 for a betterstructural stability. The conducting layer 114 simultaneously contactswith the conducting pads 110 a, 110 c, and 110 b, which may be connectedto more conducting routes.

As mentioned above, through the design of the pattern of the conductingpad, a hole simultaneously exposing a plurality of conducting pads maybe formed in a single etching process, increasing the number ofconducting routes which are electrically connected to by the conductinglayer to be formed in the hole (the through substrate conductingstructure). Note that because the surface profile of the formed hole isrelatively rough (because of the plurality of conducting pads withdifferent depths), the adhesion between the conducting layer and thesidewall of the hole may be improved, thus increasing the structuralstability of the through substrate conducting structure.

It should be appreciated that the design of the pattern of theconducting pad may have a variety of types and is not limited to thoseshown in FIGS. 6A-6B. FIGS. 6C-6E are top views partially showing chippackages according to embodiments of the present invention. Similarly,FIGS. 6C-6E are only used to illustrate examples, but not used to limitembodiments of the present invention.

As shown in FIG. 6C, in one embodiment, the conducting pad 110 a has arectangular opening 602 which exposes the conducting pads 110 c and 110b thereunder. The conducting pad 110 c has a plurality of rectangularopenings 604 which expose the conducting pad 110 b thereunder.

As shown in FIG. 6D, in another embodiment, the conducting pad 110 a hasa rectangular opening 602 which exposes the conducting pads 110 c and110 b thereunder. The conducting pad 110 c has a plurality ofrectangular openings 604 (or trenches) which expose the conducting pad110 b thereunder.

As shown in FIG. 6E, in yet another embodiment, the conducting pad 110 ahas a rectangular opening 602 which exposes the conducting pads 110 cand 110 b thereunder. The conducting pad 110 c has a plurality ofopenings 604 including square openings and rectangular openings (ortrenches) which expose the conducting pad 110 b thereunder. As mentionedabove, the shapes, numbers, and distributions of the openings of theconducting pad may be adjusted according to requirements.

FIGS. 4A-4B are enlarged cross-sectional views showing the steps offorming a chip package according to an embodiment of the presentinvention, wherein same or similar reference numbers are used todesignate same or similar elements, and the structure shown in FIG. 4Ais similar to that shown in FIG. 3A, and the main difference is shown inFIG. 4B.

As mentioned above, the formation of the second hole 112 includes usinga single etching process. In one situation, during the etching processto form the second hole 112, the conducting pad beside the hole may bepartially removed. As shown in FIG. 4B, portions of the conducting pads110 a and 110 c may also be etched and removed during the formation ofthe second hole 112. In this situation, the thickness of the portion ofthe conducting pad 110 a near the hole 112 increases along a directionaway from the hole 112. Similarly, in one embodiment, the thickness ofthe portion of the conducting pad 110 c near the hole 112 increasesalong a direction away from the hole 112. When the conducting layer 114is subsequently formed in the second hole 112, the conducting layer 114may still electrically contact with the conducting pads 110 a, 110 c,and 110 b. Note that because portions of the conducting pads 110 a and110 c are removed, the contact area between the conducting layer 114 andthe conducting pads 110 a and 110 c is therefore increased, as shown inFIG. 4B.

FIG. 5 is an enlarged cross-sectional view partially showing a chippackage according to an embodiment of the present invention. Similarly,in this embodiment, portions of the conducting pads 110 a and 110 b areremoved during the formation of the second hole 112. In this situation,the thickness of the portion of the conducting pad 110 a near the hole112 increases along a direction away from the hole 112. Similarly, thethickness of the portion of the conducting pad 110 b near the hole 112increases along a direction away from the hole 112. In addition, in thisembodiment, the conducting pad 110 b is designed to have an opening 605which exposes the substrate 106 thereunder. In one embodiment, thesecond hole 112 may further extend into the substrate 106. For example,in one embodiment, the second hole 112 may extend into a spacer layer ofthe substrate 106.

FIG. 7 is a cross-sectional view showing a chip package according to anembodiment of the present invention, wherein same or similar referencenumbers are used to designate same or similar elements. In thisembodiment, the chip package further includes a trench 702 which extendsfrom the upper surface 100 a towards the lower surface 100 b of thesubstrate 100. A plurality of contact holes 704 are formed at the bottomof the trench 702. The contact hole 704 exposes the conducting padstructure 110 under the substrate 100. The conducting layer 114 mayextend to the conducting pad structure along the upper surface 100 a ofthe substrate 100, the sidewall of the trench 702, and the sidewall ofthe contact hole 704, and the conducting pad structure 110 may besimilar to the embodiments mentioned above and include a plurality ofconducting pads having specifically designed patterns. The conductinglayer 114 may extend along the sidewalls of the formed holes toelectrically contact with the conducting pads. In addition, in thisembodiment, the substrate 100 may include a transparent substrate 106 band a spacer layer 106 a disposed thereon. The spacer layer 106 a, thesubstrate 100, and the transparent substrate 106 b may surround acavity. A chip 700 may be disposed in the cavity, which may be, forexample, (but is not limited to) a light sensing chip or a lightemitting chip.

In a chip package according to embodiments of the invention, eachpattern of the multi-layered conducting pads is designed such that athrough-substrate conducting structure formed in the package mayelectrically contact with the multi-layered conducting pads, improvingthe structural reliability of the chip package and increasing conductingroutes connected to the through-substrate conducting structure.

FIGS. 8-13 are cross-sectional views showing the steps of forming a chippackage according to an embodiment of the present invention. As shown inFIG. 8, a wafer 1 is provided, which includes a plurality of chips 3such as a CMOS image sensor chip. The chip includes a substrate 5,wherein an active region 10A and peripheral circuit regions 10B aredefined. The chip 3 has a front surface 100 a and a back surface 100 b.An image sensor device 7 and a conducting pad structure 9 are disposedon the front surface 100 a in the active region 10A and the peripheralcircuit region 10B, respectively. The substrate 5 includes, for example,a semiconductor material or a ceramic material. In one embodiment, thesubstrate 5 is a semiconductor wafer (such as a silicon wafer) which issuitable for a wafer-level packaging process. Adopting a wafer-levelpackaging process to form chip packages may reduce fabrication cost andfabrication time.

In one embodiment, the conducting pad structure 9 may be constructed bya metal layer or a stacked structure composed by a plurality ofconducting pads such as a plurality of conducting pads having adielectric layer 11 interposed therebetween. The detailed structure ofthe conducting pad structure 9 will be illustrated in company with thefollowing embodiments. Typically, a chip passivation layer 13, such asan oxide layer, nitride layer, or composite layer, is covered on thefront surface of the chip. An opening may be optionally formed in thechip passivation layer 13 on the position above the conducting padstructure, depending on the packaging process type.

Referring to FIG. 9, in one embodiment the front surface 100A of thewafer 1 is bonded to a carrier wafer 17 to form a bonding surface,wherein the wafer 1 and the carrier wafer may be bonded together througha bonding layer 15, depending on the bonding techniques. Thus, in oneembodiment, the bonding surface between the conducting pad structure 9on the front surface 100A and the carrier wafer 17 includes anintermediate layer 19 such as the chip passivation layer 13 and/or thebonding layer 15. A thinning process may be next applied to the backsurface 100B of the wafer 1 such that light can enter the image sensingregion from the back surface.

Referring to FIG. 10, in the next process step, another carrier wafer 23is attached on the back surface 100B of the substrate 5 of the wafer,which may be, for example, a wafer composed of a transparent materialsuch as glass. A spacer layer 21 may be formed between the substrate 5and the carrier wafer 23. In one embodiment, a cavity may be formed onthe active region of the substrate 5 and between the carrier wafer 23and the spacer layer 21. Another thinning process may be performed toreduce a thickness of the carrier wafer 17.

Referring to FIG. 11, a through hole 25 is subsequently formed inlocations in the carrier wafer corresponding to the conducting padstructures. In this embodiment, the through hole is chosen to be formedwith a conical or pyramidical profile with a steep sidewall, wherein theangle θ is between about 90° and 92°. Then, an insulating layer 27, suchas an oxide layer, a light sensitive insulating layer, or a photoresistis conformally formed such that the insulating layer extends from thecarrier wafer 17 to an inner sidewall and a bottom of the through hole25.

Referring to FIG. 12, a process step where the conducting pad structure9 is exposed is performed to form an opening 30 at the bottom of thethrough hole 25. In this embodiment, the opening may penetrate a bondingsurface, such as the intermediate layer 19, between two wafers. Thedepth of the opening may stop at an upper surface of the conducting padstructure and/or partially penetrate the conducting pad to reach thedielectric layer 11. Alternatively, the depth of the opening may furtherpartially or completely penetrate the substrate 5 and stop at the spacerlayer 21. The process steps and the structure mentioned above will beillustrated in detail in the following description.

Referring to FIG. 13, a conducting layer 32 formed of, for example, ametal material is conformally formed on the surface of the carrier wafer17. The conducting layer extends into the sidewall and the bottom of thethrough hole and the opening 30 to contact the conducting pad structureto form a conducting route. Then, a passivation layer 34 formed of, forexample, a solder mask material is filled therein. Then, externalconnecting elements such as pads electrically connecting to theconducting layer 32 are fabricated and a wafer dicing process isperformed to finish the fabrication of the chip package (not shown).

In another embodiment, as shown in FIGS. 14A and 14B, a cross-sectionalview and a top view of another through hole structure are shown. In thisembodiment, a process step such as an etching process is performed tothe surface of the carrier wafer 17 to remove a portion of the materialof the substrate such that a trench T having a predetermined depth D isformed. In the case that the carrier wafer 17 is a blank wafer, becauseno circuit element is formed therein, the opening, the location, or thedepth of the trench T has more variations. The trench T may be formed ona location including a scribe line SC. Meanwhile, the range of thetrench T may correspond to a plurality of conducting pad structures 9.For example, the range of the trench includes a whole sideline region.Then, a process step such as an etching process is performed to thebottom of the trench to remove a portion of the substrate material toform a plurality of through holes H each having a predetermined depthD1. Note that because the trench T can significantly reduce an aspectratio of the through hole H, the difficulty of the process step offorming the opening 30 at the bottom of the through hole H can bereduced.

Hereafter, the manufacturing process of the opening 30 and the stackedstructure of the conducting pad structures 9 (multilayer conductingpads) are illustrated.

Referring to FIG. 15A, an enlarged cross-sectional view showing the areaof the opening 30 and the conducting pad 9 of the embodiment shown inFIG. 12 or FIG. 14A is shown. Multilayer conducting pads 9A and 9B,interlayer dielectric layers 11, and a bonding surface such as anintermediate layer 19 are formed on the substrate 5. In one embodiment,a pattern of the upper conducting pad 9A is designed such that a portionof the lower conducting pad 9B is exposed. In one embodiment, the upperconducting pad 9A has at least an insulating window 36. The insulatingwindow 36 corresponds to the conducting pad 9B directly thereunder. Thatis, an opening, a recess, or a trench is simultaneously defined duringthe fabrication process of the upper conducting pad 9A, which is filledwith the interlayer dielectric layer 11. In this embodiment, theinsulating window 36 overlaps with a portion of the lower conducting pad9B. The insulating window 36 is formed before the formation of thethrough hole or the bonding of the carrier wafer 17.

Then, with reference made to FIG. 14A, after the through hole H and theinsulating layer 27 are formed in the substrate of the carrier wafer 17,a portion of the insulating layer 27 on the bottom of the through hole His removed to form the opening 30, wherein this process step may besimultaneously or successively performed with the following processstep. As shown in FIG. 15B, the process step includes removing theintermediate layer 19 to form the insulating window 36, and a portion ofthe interlayer dielectric layer 11 to expose a sidewall of the upperconducting pad 9A and a surface of the lower conducting pad 9B. Forexample, a suitable etching process including a photolithography processand an etching process may be chosen to accomplish the fabricationprocess mentioned above since the etching selectivity for the insulatinglayer and the metal are different.

Then, as shown in FIG. 15C, the conducting layer 32 is formed toelectrically connect one or multiple layers of the conducting padstructure. For example, the conducting pad 32 may simultaneously contactwith the sidewall of the upper conducting pad and/or the upper surfaceof the lower conducting pad.

Referring to FIGS. 16A-16C, cross-sectional views showing the steps offorming a stacked structure of three conducting pads are illustrated,which includes an upper conducting pad 9A on an insulating window 36A,an intermediate conducting pad 9B having an insulating window 36B, and alower conducting pad 9C, wherein the insulating window 36A is largerthan the insulating window 36B, and both the two insulating windowscorrespond to an upper surface of the lower conducting pad 9C. In thisembodiment, as shown in FIG. 16C, the formed conducting layer 32 may beelectrically connected to one or multiple layers of the conducting padstructure. For example, the conducting layer 32 may simultaneouslycontact with a sidewall of the upper conducting pad 9A, an upper surfaceand a sidewall of the intermediate conducting pad 9B, and/or an uppersurface of the lower conducting pad 9C.

Next, referring to FIGS. 17A-17C, cross-sectional views showing thesteps of forming a stacked structure of three conducting pads areillustrated. The difference between the embodiment and the embodimentmentioned above is that the lower conducting pad 9C also includes aninsulating window 36C which has a corresponding relationship with theinsulating window 36A of the upper conducting pad 9A and the insulatingwindow 36B of the intermediate conducting pad 9B. Note that theinsulating window 36C of the lower conducting pad 9C is smaller than theinsulating windows 36A and 36B.

The step of forming the opening 30 includes removing the intermediatelayer 19, the insulating windows 36A, 36B, and 36C, and a portion of theinterlayer dielectric layer 11 to expose the sidewalls and a portion ofthe upper surface of the multilayer conducting pads. For example, asuitable etching process including a photolithography process and anetching process may be chosen to accomplish the fabrication processmentioned above since the selectivity for the insulating layer and themetal are different. Therefore, a contact area between the subsequentlyformed conducting layer 32 and the stacked structure of the conductingpads may be increased and the conducting layer 32 may be conformallyformed.

According to required characteristics, the spacer layer 21 may also bechosen as a blocking layer. A portion of the silicon substrate 5 isfurther removed to form an opening 30A. The opening 30A may be locatedin the silicon substrate 5 or expose the spacer layer 21. Then, as shownin FIG. 17C, a conducting layer 32 is formed to electrically connect toone layer or multiple layers of the conducting pad structure.Alternatively, the conducting layer may simultaneously contact with asidewall and/or an upper surface of the conducting pad. The conductinglayer 32 may extend from the opening 30A to the silicon substrate 5. Inone embodiment, before the conducting layer 32 is formed, anotherinsulating layer 38 may be formed in the opening 30A. Alternatively, anoxidation process may be performed to form an oxide layer on the siliconsubstrate 5 in the opening 30A.

FIGS. 18A-18G are cross-sectional views showing the steps of forming achip package according to an embodiment of the present invention. Asshown in FIG. 18A, a substrate 300 is provided, which has a surface 300a and a surface 300 b. The substrate 300 may be, for example, asemiconductor wafer such as a silicon wafer. In one embodiment, aplurality of predetermined scribe lines SC may be defined in thesubstrate 300 which divide the substrate 300 into a plurality ofregions. In each of the regions, at least a device region 302 is formed.In one embodiment, the device region 302 may include an optoelectronicdevice such as an image sensor device or a light emitting device. Aplurality of conducting pad structures 306 are formed on the surface 300a of the substrate 300, which are located in an insulating layer 304 (ordielectric layer) on the surface 300 a. Each of the conducting padstructures 306 may include a plurality of conducting pads which arestacked with each other. The stacked conducting pads may be electricallyconnected to each other (through, for example, vertical conductingstructures between the stacked conducting pads). Alternatively, thestacked conducting pads may be electrically insulated from each other.In one embodiment, at least one of the conducting pads is electricallyconnected to the device region 302. It should be appreciated thatthicknesses of the insulating layer 304 and the conducting padstructures 306 are actually thinner. For clarity, the thicknesses of theinsulating layer 304 and the conducting pad structure 306 in thedrawings are enlarged and do not correspond to actual size ratios.

Then, a carrier substrate 310 is disposed on the substrate 300. Aplurality of spacer layers 308 may be disposed between the carriersubstrate 310 and the substrate 300. The spacer layers 308 and thecarrier substrate 310 may surround a plurality of cavities on thesubstrate 300, wherein there may be at least a device region 302 locatedunder each of the cavities. The spacer layer 308 may cover theconducting pad structure 306. In the embodiment where the device region302 includes an optoelectronic device (such as an image sensor device ora light emitting device), a transparent substrate (such as a glasssubstrate, quartz substrate, or transparent polymer substrate) may bechosen to serve as the carrier substrate 310 for facilitating light whenentering the device region 302 or when being emitted from the deviceregion 302.

As shown in FIG. 18B, the substrate 300 may then be optionally thinnedto facilitate subsequent processes. For example, the carrier substrate310 may be used as a support, and the substrate 300 may be thinned fromthe surface 300 b of the substrate 300. A suitable thinning process mayinclude, for example, a mechanical grinding, chemical mechanicalpolishing, or etching process.

Next, as shown in FIG. 18C, a portion of the substrate 300 is removed toform a hole 312 extending from the surface 300 b of the substrate 300towards the conducting pad structure 306. For example, aphotolithography process and an etching process may be applied to formthe hole 312. In one embodiment, a sidewall of the hole 312 issubstantially perpendicular to the surface 300 b of the substrate 300.

As shown in FIG. 18D, a portion of the substrate 300 is then removed toform a recess 314 extending from the surface 300 b towards the surface300 a of the substrate 300. In one embodiment, the recess 314 may beformed by using, for example, a photolithography process and an etchingprocess. The recess 314 may overlap with a plurality of holes 312. Forexample, the recess 314 may overlap with the holes 312 located indifferent regions beside the scribe line SC. The recess 314 may alsooverlap with the adjacent holes 312 located in a same region defined bythe scribe lines SC. For example, the relationship between the recess314 and the holes 312 may be similar to that shown in FIG. 14B.

In one embodiment, because the recess 314 is formed after the formationof the hole 312, an etching gas or an etching solution enters the hole312 and partially removes the substrate 300 during the formation of therecess 314. Thus, in one embodiment, after the recess 314 is formed, thehole 312 is enlarged and in FIG. 18D, is denoted by the reference number“312 a”. The sidewall of the hole 312 a inclines to the surface 300 b ofthe substrate 300. Alternatively, the sidewall of the hole 312 ainclines to the bottom of the recess 314. In one embodiment, the widthof the hole 312 a increases along a direction towards the surface 300 b.

Then, an insulating layer 316 may be formed on the surface 300 b of thesubstrate 300. A material of the insulating layer 316 may be, forexample, an oxide, nitride, oxynitride, polymer material, orcombinations thereof. The insulating layer 316 may be formed by vapordeposition, thermal oxidation, or coating. In one embodiment, theinsulating layer 316 is substantially and conformally located on thesurface 300 b of the substrate 300, the sidewall of the recess 314, andthe sidewall and the bottom of the hole 312 a.

Next, as shown in FIG. 18E, a portion of the insulating layer 316 on thebottom of the hole 312 a is removed, and a hole 312 b is then formed. Inone embodiment, a portion of the insulating layer 304, a portion of theconducting pad structure 306, and a portion of the spacer layer 308 maybe removed by using, for example, a photolithography process and anetching process to form the hole 312 b. In another embodiment, each ofthe conducting pads in the conducting pad structure 306 has already beenpatterned to have openings exposing the conducting pads thereunder. Inthis case, only the insulating layer 304 needs to be etched during theformation of the hole 312 b, wherein no conducting pad needs to beetched.

As shown in FIG. 18F, a patterned conducting layer 318 is then formed onthe surface 300 b of the substrate 300. A material of the conductinglayer 318 may include, for example, copper, aluminum, nickel, gold,platinum, or combinations thereof. The conducting layer 318 may beformed by, for example, physical vapor deposition, chemical vapordeposition, coating, electroplating, electroless plating, orcombinations thereof.

The conducting layer 318 may extend from the surface 300 b of thesubstrate 300 towards the conducting pad structure 316, along thesidewall of the recess 314, the sidewall of the hole 312 a, and thesidewall of the hole 312 b, to electrically contact with the conductingpad structure 316.

It should be appreciated that although in the embodiment shown in FIG.18F, the conducting layer 318 electrically contacts with threeconducting pads and penetrates through the insulating layer 304 to enterthe spacer layer 308 and directly contact with the spacer layer 308, theembodiments of the present invention are not limited thereto. The hole312 b of the embodiments of the invention is not limited to be extendinginto the spacer layer 308. According to the embodiments of theinvention, the conducting layer 318 and the conducting pad structure 306may also have a structure similar to that shown in FIG. 2C, 3C, or 4B.In addition, the conducting pad structure 306 may also have manyvariations. For example, the conducting pad structure 306 may have astructure similar to one of those shown in FIGS. 6A-6E.

Still referring to FIG. 18F, a solder mask layer 320 may then be formedon the surface 300 b of the substrate 300. In one embodiment, the soldermask 320 may have an opening (not shown) exposing the conducting layer318, and a conducting structure (not shown) such as a solder ball may beformed on the exposed conducting layer 318. In one embodiment, becausethe recess 314 and the holes (312 a and 312 b) have inclined sidewalls,the material used for forming the solder mask layer 320 may be filledinto the hole more easily. In one embodiment, the solder mask layer 320substantially and completely fills the recess 314 and the holes (312 aand 312 b) such that there is substantially no void or air bubble formedin the solder mask layer 320.

Next, the structure shown in FIG. 18F is diced along the predeterminedscribe lines SC to form a plurality of separate chip packages, as shownin FIG. 18G.

FIGS. 19A-19F are cross-sectional views showing the steps of forming achip package according to an embodiment of the present invention. Asshown in FIG. 19A, a substrate 400 is provided, which has a surface 400a and a surface 400 b. The substrate 400 may be, for example, asemiconductor wafer such as a silicon wafer. In one embodiment, aplurality of predetermined scribe lines SC may be defined in thesubstrate 400 which divide the substrate 400 into a plurality ofregions. In each of the regions, at least a device region 402 is formed.In one embodiment, the device region 402 may include an optoelectronicdevice such as an image sensor device or a light emitting device. Aplurality of conducting pad structures 406 are formed on the surface 400a of the substrate 400, which are located in an insulating layer 404 (ordielectric layer) on the surface 400 a. Each of the conducting padstructures 406 may include a plurality of conducting pads which arestacked with each other. The stacked conducting pads may be electricallyconnected to each other (through, for example, vertical conductingstructures between the stacked conducting pads). Alternatively, thestacked conducting pads may be electrically insulated from each other.In one embodiment, at least one of the conducting pads is electricallyconnected to the device region 402. It should be appreciated thatthicknesses of the insulating layer 404 and the conducting padstructures 406 are actually thinner. For clarity, the thicknesses of theinsulating layer 404 and the conducting pad structure 406 in thedrawings are enlarged and do not correspond to actual size ratios.

Then, a carrier substrate 407 is disposed on the surface 400 a of thesubstrate 400. The carrier substrate 407 is fixed on the insulatinglayer 404 on the substrate 400 through an adhesion layer (not shown) orbonding of another type. In one embodiment, a size and a shape of thecarrier substrate 407 are substantially the same as those of thesubstrate 400 thereunder. In one embodiment, the carrier substrate 407is a semiconductor wafer such as a silicon wafer.

As shown in FIG. 19B, the carrier substrate 407 may be used as asupport, and the substrate 400 is thinned from the surface 400 b of thesubstrate 400. A suitable thinning process may include, for example, amechanical grinding, chemical mechanical polishing, or etching process.

Then, another carrier substrate 410 is disposed on the substrate 400. Aplurality of spacer layers 408 may be disposed between the carriersubstrate 410 and the substrate 400. The spacer layers 408 and thecarrier substrate 410 may surround a plurality of cavities on thesubstrate 400, wherein there may be at least a device region 402 locatedunder each of the cavities. The spacer layer 408 may cover theconducting pad structure 406. In the embodiment where the device region402 includes an optoelectronic device (such as an image sensor device ora light emitting device), a transparent substrate (such as a glasssubstrate, quartz substrate, or transparent polymer substrate) may bechosen to serve as the carrier substrate 410 for facilitating light whenentering the device region 402 or when being emitted from the deviceregion 402. In addition, because the substrate 400 has been thinned,light only needs to penetrate the carrier substrate 410 (transparentsubstrate) and the thinned substrate 400 without penetrating theinsulating layer 404 and the conducting pad structure 406 when lightenters or is emitted from the device region 402. Thus, the transmissionof light becomes more efficient.

Next, as shown in FIG. 19C, in one embodiment, the carrier substrate 410may then be used as a support, and a portion of the carrier substrate407 is removed from an upper surface of the carrier substrate 407 (byusing, for example, a photolithography process and an etching process)to form a hole extending from the upper surface of the carrier substrate407 towards the conducting pad structure 406. In one embodiment, asidewall of the formed hole (not shown) is substantially perpendicularto the upper surface of the carrier substrate 407.

Next, a portion of the carrier substrate 407 is removed to form a recess414 extending from the upper surface of the carrier substrate 407towards the substrate 400. In one embodiment, the recess 414 may beformed by using, for example, a photolithography process and an etchingprocess. The recess 414 may overlap with a plurality of holes. Forexample, the recess 414 may overlap with the holes located in differentregions beside the scribe line SC. The recess 414 may also overlap withthe adjacent holes located in a same region defined by the scribe linesSC. For example, the relationship between the recess 414 and the holesmay be similar to that shown in FIG. 14B.

In one embodiment, because the recess 414 is formed after the formationof the holes mentioned above, an etching gas or an etching solutionenters the holes and partially removes the substrate 400 during theformation of the recess 414. Thus, in one embodiment, after the recess414 is formed, the hole is enlarged and in FIG. 19C, it is denoted bythe reference number “412 a”. The sidewall of the hole 412 a inclines tothe upper surface of the carrier substrate 407. Alternatively, thesidewall of the hole 412 a inclines to the bottom of the recess 414. Inone embodiment, the width of the hole 412 a increases along a directiontowards the upper surface of the carrier substrate 407.

Then, an insulating layer 416 may be formed on the upper surface of thecarrier substrate 407. A material of the insulating layer 416 may be,for example, an oxide, nitride, oxynitride, polymer material, orcombinations thereof. The insulating layer 416 may be formed by vapordeposition, thermal oxidation, or coating. In one embodiment, theinsulating layer 416 is substantially and conformally located on theupper surface of the carrier substrate 407, the sidewall of the recess414, and the sidewall and the bottom of the hole 412 a.

Next, as shown in FIG. 19D, a portion of the insulating layer 416 on thebottom of the hole 412 a is removed, and a hole 412 b is then formed. Inone embodiment, a portion of the insulating layer 404, a portion of theconducting pad structure 406, and a portion of the spacer layer 408 maybe removed by using, for example, a photolithography process and anetching process to form the hole 412 b. In another embodiment, each ofthe conducting pads in the conducting pad structure 406 has already beenpatterned to have openings exposing the conducting pads thereunder. Inthis case, only the insulating layer 404 needs to be etched during theformation of the hole 412 b, wherein no conducting pad needs to beetched.

As shown in FIG. 19D, in one embodiment, a patterned insulating layer417 may be optionally formed on the bottom and a portion of the sidewallof the hole 412 b. The insulating layer 417 covers the substrate 400originally exposed in the hole 412 b. The insulating layer 417 does notcover the conducting pad structure 406.

Next, as shown in FIG. 19E, a patterned conducting layer 418 is formedon the upper surface of the carrier substrate 407. A material of theconducting layer 418 may include, for example, copper, aluminum, nickel,gold, platinum, or combinations thereof. The conducting layer 418 may beformed by, for example, physical vapor deposition, chemical vapordeposition, coating, electroplating, electroless plating, orcombinations thereof.

The conducting layer 418 may extend from the upper surface of thecarrier substrate 407 towards the conducting pad structure 416, alongthe sidewall of the recess 414, the sidewall of the hole 412 a, and thesidewall of the hole 412 b, to electrically contact with the conductingpad structure 416.

It should be appreciated that although in the embodiment shown in FIG.19E, the conducting layer 418 electrically contacts with threeconducting pads and penetrates through the insulating layer 404 to enterthe spacer layer 408 and directly contact with the spacer layer 408, theembodiments of the present invention are not limited thereto. The hole412 b of the embodiments of the invention is not limited to be extendinginto the spacer layer 408. According to the embodiments of theinvention, the conducting layer 418 and the conducting pad structure 406may also have a structure similar to that shown in FIG. 2C, 3C, or 4B.In addition, the conducting pad structure 406 may also have manyvariations. For example, the conducting pad structure 406 may have astructure similar to one of those shown in FIGS. 6A-6E.

Still referring to FIG. 19E, a solder mask layer 420 may then be formedon the upper surface of the carrier substrate 407. In one embodiment,the solder mask 420 may have an opening (not shown) exposing theconducting layer 418, and a conducting structure (not shown) such as asolder ball may be formed on the exposed conducting layer 418. In oneembodiment, because the recess 414 and the holes (412 a and 412 b) haveinclined sidewalls, the material used for forming the solder mask layer420 may be filled into the hole more easily. In one embodiment, thesolder mask layer 420 substantially and completely fills the recess 414and the holes (412 a and 412 b) such that there is substantially no voidor air bubble formed in the solder mask layer 420.

Next, the structure shown in FIG. 19E is diced along the predeterminedscribe lines SC to form a plurality of separate chip packages, as shownin FIG. 19F.

While the invention has been described by way of example and in terms ofthe preferred embodiments, it is to be understood that the invention isnot limited to the disclosed embodiments. To the contrary, it isintended to cover various modifications and similar arrangements (aswould be apparent to those skilled in the art). Therefore, the scope ofthe appended claims should be accorded the broadest interpretation so asto encompass all such modifications and similar arrangements.

What is claimed is:
 1. A method for forming a chip package, comprising:providing a substrate having an upper surface and a lower surface,wherein the substrate comprises: a plurality of conducting pads locatedbelow the lower surface of the substrate; and a dielectric layer locatedbetween the conducting pads; removing a portion of the substrate fromthe upper surface of the substrate to form a hole extending towards theconducting pads; after the hole is formed, removing a portion of thesubstrate from the upper surface of the substrate to form a trenchextending towards the lower surface of the substrate, wherein the trenchconnects with the hole; forming an insulating layer on a sidewall of thetrench and a sidewall and a bottom of the hole; removing a portion ofthe insulating layer and a portion of the dielectric layer to expose aportion of the conducting pads; and forming a conducting layer on thesidewall of the trench and the sidewall and the bottom of the hole,wherein the conducting layer electrically contacts with the conductingpads.
 2. The method for forming a chip package as claimed in claim 1,wherein the sidewall of the hole inclines to the lower surface of thesubstrate after the trench is formed.
 3. The method for forming a chippackage as claimed in claim 2, wherein the sidewall of the hole issubstantially perpendicular to the lower surface of the substrate beforethe trench is formed.
 4. The method for forming a chip package asclaimed in claim 1, wherein an upper conducting pad of the conductingpads has at least an opening or a trench, wherein the opening or thetrench exposes a lower conducting pad of the conducting pads.
 5. Themethod for forming a chip package as claimed in claim 1, wherein athickness of at least one of the conducting pads near the hole increasesalong a direction away from the hole.
 6. The method for forming a chippackage as claimed in claim 1, wherein the bottom of the hole exposes anupper surface of at least one of the conducting pads.
 7. The method forforming a chip package as claimed in claim 1, wherein the lower sidewallof the hole exposes a side of at least one of the conducting pads. 8.The method for forming a chip package as claimed in claim 1, furthercomprising forming a spacer layer under the conducting pads, wherein thehole further extends into the spacer layer.
 9. The method for forming achip package as claimed in claim 1, further comprising forming atransparent substrate under the spacer layer.
 10. The method for forminga chip package as claimed in claim 1, further comprising filling asolder mask layer in the hole.
 11. A method for forming a chip package,comprising: providing a substrate having a first surface and a secondsurface, wherein the substrate comprises: a plurality of conducting padslocated on the first surface of the substrate; and a dielectric layerlocated between the conducting pads; disposing a carrier substrate onthe conducting pads and the dielectric layer on the first surface of thesubstrate; removing a portion of the carrier substrate from an uppersurface of the carrier substrate to form a hole extending towards theconducting pads; after the hole is formed, removing a portion of thecarrier substrate from the upper surface of the carrier substrate toform a trench extending towards the substrate, wherein the trenchconnects with the hole; forming an insulating layer on the sidewall ofthe trench and the sidewall and the bottom of the hole; removing aportion of the insulating layer and a portion of the dielectric layer toexpose a portion of the conducting pads; and forming a conducting layeron the sidewall of the trench and the sidewall and the bottom of thehole, wherein the conducting layer electrically contacts with theconducting pads.
 12. The method for forming a chip package as claimed inclaim 11, wherein the hole extends into the substrate, and theconducting layer extends into the substrate.
 13. The method for forminga chip package as claimed in claim 12, further comprising forming asecond insulating layer between the substrate and the conducting layer.14. The method for forming a chip package as claimed in claim 11,wherein an upper conducting pad of the conducting pads has at least anopening or a trench, wherein the opening or the trench exposes a lowerconducting pad of the conducting pads.
 15. The method for forming a chippackage as claimed in claim 11, wherein a thickness of at least one ofthe conducting pads near the hole increases along a direction away fromthe hole.
 16. The method for forming a chip package as claimed in claim11, wherein the bottom of the hole exposes an upper surface of at leastone of the conducting pads.
 17. The method for forming a chip package asclaimed in claim 11, wherein the lower sidewall of the hole exposes aside of at least one of the conducting pads.
 18. The method for forminga chip package as claimed in claim 11, further comprising forming aspacer layer under the conducting pads, wherein the hole further extendsinto the spacer layer.
 19. The method for forming a chip package asclaimed in claim 11, further comprising filling a solder mask layer inthe hole.
 20. The method for forming a chip package as claimed in claim11, wherein the sidewall of the hole inclines to the lower surface ofthe substrate after the trench is formed, and wherein the sidewall ofthe hole is substantially perpendicular to the lower surface of thesubstrate before the trench is formed.